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PCB layout phase 1: stackup, outline, edge/panel placement (unrouted) - #3

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NT7S merged 37 commits into
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pcb-layout
Oct 25, 2026
Merged

NT7S merged 37 commits into
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pcb-layout

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@NT7S NT7S commented Oct 24, 2026

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Depends on #2 (rev-a-schematic). This branch is built on top of it; merge #2 first. Draft, do not merge.

Phase 1 only, with no traces routed:

  • Board updated from the schematic: 121 footprints, DRC schematic parity 0.
  • 4-layer JLC04161H-7628 stackup, 1.6 mm, blue mask. RF50 netclass with 0.35 mm traces (CPWG 0.35 mm trace / 0.20 mm gap over In1 GND; microstrip ≈0.37 mm).
  • Board is 100 x 65 mm with R3 corners and 4x M3 holes at (4,4), (96,4), (4,61), (96,61).
  • SMAs J2-J4 on the right edge at y=16/33/50 (DNP, user-soldered). USB-C on the bottom edge at x=28. Encoder shaft at (60,22). Buttons at y=46. OLED module area plus a 2 mm keepout at the top left. UPDI header at (66,61).
  • docs/mechanical: dimensioned outline (PDF/PNG) and board STEP.
  • Simple placeholder 3D models in PCB/lib/Etherkit.3dshapes for parts with no library model.

Known DRC items: SMA pads sit at the board edge on purpose (end-launch), J1's stock footprint has a hole clearance of 0.185 mm, silkscreen is not tidied yet, and nothing is routed.

KiCad EE and others added 30 commits October 23, 2026 20:17
…p (blue mask), RF50 netclass 0.35 mm, 100x65 outline + 4x M3, edge/panel part placement, OLED keepout, rough placement (unrouted); simple 3D models; mechanical outline + STEP
…mm tact switches, plated GND M3 holes, In1 cut under SMA centre pads, In1/In2 GND planes, Etherkit branding + Rev A on F.Cu; regen renders/outline/STEP
…upling at U2/X1 pins, power/USB tidied (LDO rows Cin-U-Cout-FB), CLK0-2 labels, horizontal front branding, back-silk book line, silkscreen overlaps cleared; regen renders/outline/STEP
…adder -> out-select -> SMA), bypass jumper at input end behind GND via fence; J5 UPDI title + pin labels
…select jumpers, Cauer LPF, bypass lane to SMAs; GND vias at all SMD GND pads; RF stitching; F/B GND pours
…ower+digital (WIP, 26 unconnected); Alps EC11E18244A5 model for SW1; regen board STEP
…g; add tools/pcbgen build scripts; U3 EP vias; OLED-area F.Cu track keepout
…ing, 0402 CLK series Rs, RF50 incl. CLK*_BYP; regen docs
…>U2 on In2/B.Cu; C26 at VDDO pin 7, C4 at VDD pin 1
…ks at 0.20-0.21 mm, all RF lanes 0.31 mm except 0.25 mm U2 pin breakouts)
…ut, 20 vias closing >2.2 mm gaps on filter fence lines
…est of +3V3_CLK trunk clear of UPDI legend; DRC: only SMA edge-launch hits
…nts, models, router/stitch helpers, fr.ses); document hand-fix caveat
KiCad EE added 7 commits October 24, 2026 15:57
…/SDA) on B.Cu, 1.5 mm SMD, excluded from BOM/CPL; no RF nets. JLC fab outputs (tools/export_fab.sh -> PCB/production). ERC 0, DRC only the 15 accepted SMA edge hits
…C105580->C23186 (0603WAF5101T5E). Board fields synced, ERC 0, DRC 15 accepted SMA hits, fab outputs + schematic PDF regenerated
…usb second set renamed #PWR920-923 (property + instance reference). Netlist export clean, ERC 0, DRC 15 accepted SMA hits, BOM/CPL unchanged; docs regenerated
…03WAF1001T5E 1%), grouped with R29. Extended parts 33->32. ERC 0, DRC 15 accepted SMA hits, 0 unconnected/parity; fab + docs regenerated
…d docs conflicted, regenerated from merged schematic (ERC 0)
@NT7S
NT7S marked this pull request as ready for review October 25, 2026 16:49
@NT7S
NT7S merged commit 116caa2 into master Oct 25, 2026
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